TE Connectivity has upgraded its rugged Mezalok mezzanine connector family to support the growing demand for higher data rates and improved processing power with icreased data rate support up to 32+ Gbit/s.
The Mezalok connector family has been designed specifically for mezzanine cards in rugged applications and is standardized as the interconnect for XMC 2.0 (VITA 61). Rapidly evolving technologies in signal intelligence, radar, communications and surveillance are driving the need for more powerful embedded computing solutions.
The connector uses four points of contact, based on the M55302 standard, with two used for a low force extraction version later this summer. There is also a protected socket end for reliable blind mateability and thermal stability to 2,000 thermal shock cycles.
Mezzanine cards are often used to provide additional functionality and processing capability within a small form factor. TE designed the Mezalok connector family to support these applications. Typical applications include application-specific high-speed input/output (I/O) protocols, graphics, memory and digital-signal processing.
"New designs in rugged embedded computing require higher speeds and high pin counts in order to pack more functionality into smaller plug-in modules," said Jason Dorwart, product manager for TE’s Aerospace, Defense and Marine division. "TE recognizes this trend and is continuing to build on this platform to help solve customer needs, offering new options in stack height, pin density and higher speeds, giving the system designer a broader solution set to work with when needing a fast, rugged and reliable mezzanine connector for extreme environments."
TE’s highly reliable Mezalok mezzanine connectors more than double the speed and durability of competing technology, making it one of the most viable options for today’s military and commercial aerospace applications. At over 5GHz, this rugged, surface mount mezzanine connector incorporates a redundant “mini-box” four-point contact system for separable interface and offers excellent signal integrity up to 32+ Gbits.
TE offers multiple positions for the connector at 60 and 130 with the 114 position for the XMC 2.0 standard. There are 10,12,15,17 and 18mm stack heights.
LCP plastic housings offer thermal stability and are low-outgassing. In addition, compliant Ball Grid Array (BGA) board attachment supports standard surface mount processing and excellent thermal stability with a contact design that provides robust, uniform solder joints.
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