Mini LED flash in a 1.4x1.4x0.21mm chip sized package

September 12, 2017 // By Julien Happich
Osram Opto Semiconductors has expanded its existing portfolio for flash applications with a product featuring a specially developed chip sized package (CSP).

Designed without the conventional ceramic package and bond wiring of its predecessors, the Ceramos C measures only 1.4x1.4x0.21mm, three times shallower than its predecessor while producing the same brightness.

The entire chip surface is uniformly illuminated and is suitable for use in smartphones or tablets that need a compact LED particularly for the front camera, but also for the main flash and for the flashlight function. With a typical color rendering index greater than 80, the LED offers natural colors no matter where it is used. Ceramos C has a luminous flux of 260 lm and a color temperature of 4,500 K.

Osram -


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