Miniature SMT test points for high density PCB packages

March 08, 2012 // By Julien Happich
Miniature SMT test points for high density PCB packages
Keystone Electronics has added a miniature SMT test point to its test point selection, featuring a symmetrical flat-wire design to efficiently and safely test PCBs. This latest “Mini-pad” version enables high-strength, test point-to-PCB bonding, with a minimal footprint.

In addition to cost-saving, this low profile entry accepts a variety of gripping probes to replace wire-wrap posts and turret terminals. As such it is well suited for testing circuitry of high density PCB packages. The test points are manufactured from phosphor bronze and silver plate which can accommodate the use of both lead-free solder and traditional reflow processing. Packaging is on tape and reel with 1,000 and 5,000 piece reels. All are compatible with most vacuum and mechanical pick and place assembly systems.

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