In-Mold Electronics: the transition from art to platform technology: Page 5 of 5

April 26, 2019 //By Dr Khasha Ghaffarzadeh
In-Mold Electronics
In-Mold Electronics (IME) is a technology for structurally integrating electronic functionality into 3D-shaped parts. The value proposition is compelling: the technology enables novel and elegant designs, reduces weight and saves space, and decrease part and assembly numbers.

Is IME the only solution?

As a final comment in this article, IME is not the only method of creating 3D electronics. There are multiple other existing and emerging solutions. There is LDS (Laser Direct Structure) which has been widely adopted in the past for antenna metallization and its key patents are now expiring; there is aerosol which has also had some success for 3D antenna metallization; there is 3D printed electronics which is early stage and mostly constrained to prototyping; and so on. IMD however is very different. It can create voluminous parts with structurally integrated electronics extending well beyond what other solutions essentially offer: a 3D shaped PCB. IME can also become a very high-volume mass production technique. As such, it is a process that is well differentiated from the other close alternatives.

To learn more about the technical as well as commercial aspects of this emerging opportunity refer to the IDTechEx Research report In-Mold Electronics 2019-2029: Technology, Market Forecasts, Players.

About the author:

Dr Khasha Ghaffarzadeh is Research Director at IDTechEx – www.IDTechEx.com


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