Movidius teams with Toshiba on 3-D camera system

February 02, 2012 //By Peter Clarke
Movidius teams with Toshiba on 3-D camera system
Fabless mobile multimedia chip company Movidius Ltd. has announced it has partnered with Toshiba Electronics Europe and developed a reference design of 3-D image capture system for integration by camera module makers.

In the design the MA1178 video processing chip from Movidius (Dublin, Ireland) operates with two MIPI standard streams from Toshiba image sensors at up to 8-Mpixels resolution. The chip works with extended depth of field (EDoF) cameras and can compensate for camera sensor differences or minor misalignments, Movidius said. EDoF cameras offer advantages over autofocus cameras in terms of 3-D synchronisation.

The system solution, including the Myriad 3-D software, offers flexibility for customers to implement a symmetric or asymmetric set up of either two 8-Mpixel EDoF cameras or a combination of 8- and 3-megapixel EDoF cameras.

The MA1178 is manufactured for Movidius by Taiwan Semiconductor Manufacturing Co. Ltd., (TSMC) in a 65-nm CMOS process. The company is working on a multimedia IC design targeting 28-nm that is due to tape out in 2012 with volume production expected to follow in 2013.

Movidius plans to demonstrate its MA1178 product together with the 3-D system solution at the Mobile World Congress due to be held in Barcelona, Spain, later this month.

For further information: www.movidius.com.


Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.