Nanusens MEMS sensor can be used to implement tap and double tap for control, wake-on-movement and sleep-on-rest functions, and, soon after, a 3D accelerometer. A bone conduction sensor for noise cancellation is next to be integrated into the single chip solution. Chips will be available in a small package such as WLCSP or as bare die that can be attached directly to the PCB. With a volume of about one cubic millimeter the Nanusens will save 3 cubic millimeters compared with conventional MEMS components, Montanya estimates.
Chip layout showing two Nanusens motion sensors integrated with the control electronics on the same die. Source: Nanusens.
Nanusens is also developing a bone conduction sensor for noise cancellation – due in 2019 –a 3D accelerometer for step counting, gyroscope and compass for head position sensing and microphones – all due in 2020.
The company is also working with Bluetooth SoC reference designers and a Series A round of finance of about €10 million to €15 million.
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