Leveraging Rockley OpticsDirect technology, the platform is among the first of its kind to integrate high-speed optical interconnect with high-scale CMOS digital and mixed-signal circuits. The switching ASIC employs unique low-power custom circuitry to interface to Rockley-developed photonic chips. Advanced technology for fiber-optic assembly delivers significantly lower power than conventional ASICs that use electrical IO and external optical transceiver modules. By driving optical fiber directly from the package, the Rockley product can directly connect to devices placed 500 meters away, offering a 100x improvement over today’s ASICs using all-electrical IO, claims the manufacturer.
The product employs an L3 routing ASIC designed by Rockley Photonics and silicon photonics chips manufactured on a Rockley proprietary process. The switch ASIC and silicon photonics ICs are placed into a customized package enabling fiber-optic links to connect directly into the assembly. Innovative mixed-signal circuit designs enable the photonics ICs to be driven directly by the ASIC without additional chips.
The Rockley solution was developed in cooperation with major industry partners to be suitable for rapid transition to manufacturing scale. The ASIC was manufactured in TSMC 28nm process technology. The package substrate manufacture, chip assembly and test was performed by IBM. The silicon photonics ICs were manufactured by established third-party fabrication houses using Rockley Photonics’ advanced process. The final assembly was performed by Fabrinet.