“Our transfer method is in principle applicable to any 2D material, independent of the size and the type of growth substrate,” said Prof. Max Lemme, from AMO and RWTH Aachen University. “And, since it relies only on tools and methods that are already common in the semiconductor industry, it could substantially accelerate the appearance on the market of a new generation of devices where 2D materials are integrated on top of conventional integrated circuits or microsystem.
“This work is an important step towards this goal and, although many further challenges remain, the range of potential applications is large: from photonics, to sensing, to neuromorphic computing. The integration of 2D materials could be a real game-changer for the European high-tech industry,” he said.
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