Reinforced matrixed solder ensures consistent die-level bonding

April 09, 2019 //By Julien Happich
Reinforced matrixed solder ensures consistent die-level bonding
Indium Corporation's InForms ESM02 is a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications.

The reinforced matrixed solder composite produces a high-reliability solder joint with increased thermal and mechanical performance for the development of new, or the improvement of existing, applications. The product now supports die-level bonding with a bondline of 50μm, increased lateral strength and excellent bondline co-planarity. The composite is available in ribbon and preforms.

Indium Corporation -  www.indium.com

 


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