Rugged Tiger Lake COM modules with soldered RAM

July 15, 2021 // By Nick Flaherty
Rugged Tiger Lake COM modules with soldered RAM
The conga-TC570r Tiger Lake COM module has soldered RAM for shock and vibration resistance in edge applications

congatec has launched a series of Computer-on-Modules designs using the new Intel 11th Gen Intel Core processor with soldered RAM for highest shock and vibration resistance.

The conga-TC570r is designed to withstand even extreme temperature ranges of -40°C to +85°C, the COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. These use the Tiger Lake microarchitecture with significantly greater CPU performance and nearly 3x higher GPU performance compared to their predecessors, along with PCIe Gen4 support.

Graphics and compute workloads benefit from up to 4 cores, 8 threads, and up to 96 graphics execution units for massive parallel processing throughput in the module with support for 8k displays or 4x 4k as well as convolutional neural networks (CNN) or as an AI and deep learning accelerator. The CPU integrates Intel’s AVX-512 instruction unit with support for Vector Neural Network Instructions (VNNI) is another feature accelerating AI applications. Using Intel’s OpenVINO software toolkit, which includes optimized calls for OpenCV, OpenCL kernels, and other industry tools and libraries, workloads can be extended across CPU, GPU and FPGA compute units to accelerate AI workloads, including computer vision, audio, speech, and language recognition systems.

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The Type 6 COM module includes support for Time Sensitive Networking (TSN), Time Coordinated Computing (TCC) and RTS Realtime Systems’ hypervisor for virtual machine deployments and workload consolidation in edge computing. The TDP thermal envelope is scalable from 12 W to 28 W, enabling fully sealed system designs with passive cooling only.

 

 

Processor

 

Cores/
Threads

 

Frequency at 28/15/12W TDP,
(Max Turbo) [GHz]

 

Cache [MB]

Graphics [Execution Units]

 

 

Intel Core i7-1185GRE

 

4/8

 

2.8/1.8/1.2 (4.4)

 

12

96 EU

 

 

Intel Core i5-1145GRE

 

4/8

 

2.6/1.5/1.1 (4.1)

 

8

80 EU

 

 

Intel Core i3-1115GRE

 

2/4

 

3.0/2.2/1.7 (3.9)

 

6

48 EU

 

 

Intel Celeron 6305E

 

2/2

 

1.8

 

4

48 EU

 

 

For more price sensitive applications, congatec also offers a cost optimized Intel Celeron based shock and vibration resistant variant for the extended temperature range from 0°C to 60°C.

Typical customers are OEMs of trains, commercial vehicles, construction machines, agricultural vehicles, self-driving robots and many other mobile applications in the most challenging outdoor and off-road environments. Shock and vibration resistant stationary devices are another important application area as digitization requires critical infrastructure protection (CIP) against earthquakes and other mission critical events.

The modules add LPDDR4X RAM with up to 4266 MT/s and in-band error-correcting code (IBECC) for single failure tolerance and high data transmission quality in EMI critical environments.

A value package includes rugged mounting options for the COM and carrier bundle, active and passive cooling options, optional conformal coating for protection against corrosion due to moisture or condensation, a list of recommended carrier board schematics, and for highest reliability, shock and vibration resistant components for the extended temperature range.

Additional services include shock and vibration tests for custom system designs, temperature screening, and high speed signal compliance testing, along with design-in services, and all training sessions required to simplify the use of congatec’s embedded computer technologies.

www.congatec.com/en/products/com-express-type-6/conga-tc570r/

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