Samsung to build 3nm US fab

January 26, 2021 // By Peter Clarke
Samsung planning $10 billion 3nm fab in Texas
Samsung is to build a wafer fab for 3nm chip production in the US at a cost of over $10bn.

The plan for a fab in Austin, Texas, follows the move by TSMC to build a 5nm wafer fab in Phoenix, Arizona with US government support.

Samsung bought land in 2020 and recently applied for planning permission. The plan calls for construction of the shell to start this year with production of wafers to begin in 2023. That would be on a similar time-line or even slightly ahead of that of TSMC.

In May of 2020 that Intel was reported to be in discussions with the US Department of Defense and that TSMC was in discussions with the US Department of Commerce and that Samsung was also being approached about expanding its presence in Austin.

The moves are part of a coordinated initiative to re-inforce chip manufacturing in the US for strategic reasons, and are perhaps driven by the current shortages of foundry capacity.

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