Samsung pledges $100 billion in fight for logic IC leadership: Page 2 of 2

April 25, 2019 //By Peter Clarke
Samsung semiconductor site
South Korean consumer giant Samsung Electronics has said it plans to invest 133 trillion won (about $115 billion) by 2030 to strengthen its position in logic chips.

Samsung has followed local rival SK Hynix in making a long-term pledge on semiconductor investment (see SK Hynix plans to invest $100 billion in fabs). In February of this year SK Hynix was reported said it plans to invest 120 trillion won (about $107 billion) to build four wafer fabs at a site in Yongin, 40 kilometers south of Seoul. That money is due to be spent between 2022 and 2032.

In terms of manufacturing process technology Samsung is close behind the world leader in chip manufacturing, TSMC. Both companies are in production at the nominal 7nm node and engaging with customers at 5nm. Both have also left Intel behind as it experienced problems with the introduction of its 10nm node.

Related links and articles:

www.samsung.com

News articles:

Intel tipped to retake chip crown

SK Hynix plans to invest $100 billion in fabs

Samsung to invest $291 million in Texas

Samsung wants quarter of foundry market

Samsung to introduce nanosheet transistors in 3nm node

Samsung boasts 6nm customer tape-out, about to sample 5nm FinFETs


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