Samsung Electronic has worked with Samsung Electro-mechanics (SEMCO) and packaging company Amkor Technology on a new generation of 2.5D packaging using chiplets.
The Hybrid-Substrate Cube (H-Cube) technology enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor. Samsung’s H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement large sizes into 2.5D packaging.
When integrating six or more HBMs, the difficulty and cost of manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency. Samsung solved this problem by applying a hybrid substrate structure in which HDI substrates that are easy to implement in large-area are overlapped under a high-end fine-pitch substrate.
By decreasing the pitch of solder ball, which electrically connects the chip and the substrate, by 35 percent compared to the conventional ball pitch, the size of fine-pitch substrate can be minimized, while adding an HDI substrate (module PCB) under the fine-pitch substrate to secure connectivity with the system board.
In addition, to enhance the reliability of the H-Cube solution, Samsung applied its proprietary signal/power integrity analysis technology that can stably supply power while minimizing the signal loss or distortion when stacking multiple logic chips and HBMs.
"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies," said Moonsoo Kang, senior vice president and head of foundry marketing at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."
"This development lowers barriers to entry in the HPC/AI market and demonstrates successful collaboration and partnership between the foundry and outsourced semiconductor assembly and test (OSAT) company," said JinYoung Kim, senior vice president of global R&D center at Amkor Technology.
Related links and articles:
- Samsung improves interposer-based packaging
- Intel invests $3.5 billion in chiplet packaging
- TSMC preps for 'chiplet' style manufacturing in 2021
- Report: TSMC, Japan to share cost of Tokyo chip facility
- X-Fab offers chiplet support via X-Celeprint printing process
- Chiplet-savvy TSMC to build $10 billion assembly and test plant
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