Siemens and ASE extend 3D packaging: Page 2 of 2

February 11, 2021 // By Nick Flaherty
Siemens and ASE extend deal on 3D packaging
Siemens and ASE are developing a single platform from 2.5D and 3D packaging to Fan-Out wafer-level packaging (FOWLP) technologies

The OSAT Alliance program helps promote the adoption, implementation, and growth of HDAP throughout the semiconductor ecosystem and design chain, enabling system and fabless semiconductor companies to have a friction-free path to emerging packaging technologies. The alliance uses the Siemens HDAP flow 3D packaging for the internet of things (IoT), automotive, 5G network, artificial intelligence (AI) and other fast-growing IC applications.

“We are pleased that ASE continues to develop highly innovative IC packaging solutions as part of our OSAT Alliance,” said AJ Incorvaia, senior vice president and general manager, Electronic Board Systems Division, Siemens Digital Industries Software. “In doing so, and by providing a fully validated ADK for ASE’s leading-edge FOCoS and 2.5D MEOL technologies, we expect to enable customers to more easily transition from classic chip designs to 2.5D, 3D IC, and Fan-Out solutions.”

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