Siemens and ASE extend 3D packaging

February 11, 2021 //By Nick Flaherty
Siemens and ASE extend deal on 3D packaging
Siemens and ASE are developing a single platform from 2.5D and 3D packaging to Fan-Out wafer-level packaging (FOWLP) technologies

Siemens Digital Industries Software is working with volume packaging supplier Advanced Semiconductor Engineering (ASE) on two platforms for multiple complex integrated circuit (IC) package assemblies and interconnects.

The high-density advanced packaging (HDAP) comes from the Siemens OSAT Alliance for 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) technologies and will lead to a single platform for all the advanced packaging technologies. The deal with ASE boosts the 3D chiplet adn FOWLP technology into maistream use.

ASE has developed an assembly design kit (ADK) that helps customers using ASE’s Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to make use of the full Siemens HDAP design flow. ASE and Siemens have extended their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these use the Xpedition Substrate Integrator software and Calibre 3DSTACK platform that Siemens acquired from Mentor Graphics.

“By adopting the Siemens Xpedition Substrate Integrator and Calibre 3DSTACK technologies, and through integration with the current ASE design flow, we can now leverage this mutually developed flow to significantly reduce 2.5D/3D IC and FOCoS package assembly planning and verification cycle times by about 30 to 50 percent in each design iteration,” said Dr. C.P. Hung, vice president, ASE Group. “Through the comprehensive design flow, we can now more quickly and easily co-design with our customers for 2.5D/3D IC and FOCoS design and close any physical verification issues for their entire wafer package assembly.”

Next: 3D packaging alliance 


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