The material unveiled in a paper published in Small under the title “A Self‐Assembled 2D Thermofunctional Material for Radiative Cooling” consists of a two-dimensional self-assembled array of 8µm-diameter silica spheres reported to behave almost as an ideal infrared emitter, providing a radiative cooling power of up to 350 W/m2 for a hot surface. Experimenting with the new material, the authors found that the temperature of a silicon wafer was 14 K lower during daytime when covered with the thermal emitter, reaching an average temperature difference of 19 K when the structure was backed with a silver layer. This material could passively cool any devices where an increase in temperature has drastic effects on performance, like solar panels and computer systems.
Indeed, it is estimated that cooling systems account for 15% of the global energy consumption and are responsible for 10% of greenhouse gas emissions. One could say that the cure is worse than the disease, as greenhouse gases generate global warming, thus requiring even more refrigeration.