20 nozzle smart placement for SIP packaging: Page 2 of 2

February 17, 2021 //By Nick Flaherty
20 nozzle smart placement for SIP packaging
ASM's Siplace TX micron is a dual head assembly and packaging system that can handle the smallest components and thin die for system-in-package SIP devices

The highest accuracy class is achieved with a new vacuum tool that features an exchangeable magnetic plate for rapid product changeovers. A 4mm version of the Smart Feeder Xi also makes the pickup of small components and die faster and more accurate. This uses the latest micro-tapes, or the bottoms of the blisters are vacuum-leveled to prevent inclined positions of components within the tape.

Thin dies, flip-chips and the smallest 0201m components require extremely gentle handling so the entire placement process of the TX micron can be individually programmed for each component and placement position. This includes touchless pickup and zero-force placement. For sensitive thin dies, the vision system features advanced image processing algorithms such as cracked-die inspection and die-chipping detection. That way, components with hairline fractures and lacerated edges are detected and rejected already during the pickup process.

The SIP system has the same footprint as the predecessor model at 2.23 x 1.0m (7.3 x 3.3ft) and is suitable for cleanroom environments with DIN EN ISO 14644-1 Class 7 certification.

The SIPLACE TX micron also has a range of M2M and networking capabilities. Open and standardized interfaces such as ASM OIB, IPC-HERMES-9852, IPC-CFX and IPC-SMEMA-9851 allow it to be fully integrated into workflows, higher-level MES/ERP systems, traceability solutions, and the integrated smart factory.

In addition to being a founding member of the ADAMOS joint venture for the development of an IIoT platform for manufacturing companies, ASM is working with other SMT manufacturers on the open HERMES standard as a successor to the SMEMA standard for M2M communication in SMT lines.

www.asm-smt.com

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Picture: 
The dual gantry SIPLACE TX micron can place 26 components a second including thin die and tiny 0201m parts

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