Source down in a DFN 5x6 package

July 17, 2019 //By Julien Happich
Source down
A designer, developer, and global supplier of a broad range of power semiconductors and power ICs, Alpha and Omega Semiconductor Ltd has introduced the “Source Down” in a DFN 5x6 package in combination with a 40V Shield-Gate Technology (AlphaSGT).

Offering a very low package resistance and inductance, the AOE66410 is well suited in telecommunications applications for secondary rectification, in half bridge configuration for BLDC motor applications, and battery management where paralleling is important. The AOE66410 has the same form factor of a standard DFN 5x6 package but the Source pad has the largest connection to the PCB. This will enable power supply designers to parallel devices more easily and have a larger thermal area to dissipate any losses. The package has a 1mOhms maximum resistance at 10Vgs with a maximum drain current of 100A at 25°C case temperature.

Alpha and Omega Semiconductor - www.aosmd.com


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