ST ships mass-market eSIMs for the IoT
STMicroelectronics has started mass-market shipment of its embedded SIM chips for Machine-to-Machine (M2M) applications.
ST’s industrial ST4SIM eSIMs provide all the services needed to connect IoT devices to cellular networks. They are suited to applications such as machinery condition monitoring and predictive maintenance, as well as asset tracking, energy management and connected healthcare devices.
By allowing remote management of the SIM profile in accordance with the GSMA specification, these eSIMs let customers change the connectivity provider without having access to the device.
The devices are available in the industry-standard MFF2 5mm x 6mm DFN8 wettable flank package as well as highly miniaturized wafer-level chip-scale package (WLCSP).
Related articles
- European tech for cloud eSIM, iSIM
- eSIM boom with 3.4bn by 2025
- eSIM gives cellular IoT kit instant connection
- Easy eSIM registration for mass markets
- Micron teams for first cloud-connected secure eSIM for the IoT
“With rich built-in features and access to world-class provisioning services, our ST4SIM family delivers a convenient solution for numerous M2M applications,” said Laurent Degauque, Marketing Director, Secure Microcontroller Division, STMicroelectronics. “Mass-market availability now lets developers everywhere leverage secure and flexible cellular connectivity in more applications than ever, including independent M2M development, proof-of-concept, and prototype projects.”
ST also takes care of activation and deployment by arranging for customers to use device-onboarding and service-provisioning platforms provided by ST Authorized Partner Truphone.
ST’s B-L462E-CELL1 Discovery kit uses the ST4SIM, allowing developers to test and evaluate all product features pre-integrated in a complete ecosystem.
The ST4SIM is certified by GSMA and manufactured at ST’s GSMA secure sites in Europe and southeast Asia. The ST4SI2M0020TPIFW is now available through e-distributors.
Other articles on eeNews Europe
- First stacked SPAD ToF depth sensor for automotive LiDAR
- SDK turns iPhones into head and eye tracker
- Philips completes sale of domestic appliances business
- TSMC price rise to drive global equipment costs
- Marvell founders back data centre RISC-V chiplet startup