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ST ships mass-market eSIMs for the IoT

ST ships mass-market eSIMs for the IoT

Business news |
By Nick Flaherty



STMicroelectronics has started mass-market shipment of its embedded SIM chips for Machine-to-Machine (M2M) applications.

ST’s industrial ST4SIM eSIMs provide all the services needed to connect IoT devices to cellular networks. They are suited to applications such as machinery condition monitoring and predictive maintenance, as well as asset tracking, energy management and connected healthcare devices.

By allowing remote management of the SIM profile in accordance with the GSMA specification, these eSIMs let customers change the connectivity provider without having access to the device.

The devices are available in the industry-standard MFF2 5mm x 6mm DFN8 wettable flank package as well as highly miniaturized wafer-level chip-scale package (WLCSP).

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“With rich built-in features and access to world-class provisioning services, our ST4SIM family delivers a convenient solution for numerous M2M applications,” said Laurent Degauque, Marketing Director, Secure Microcontroller Division, STMicroelectronics. “Mass-market availability now lets developers everywhere leverage secure and flexible cellular connectivity in more applications than ever, including independent M2M development, proof-of-concept, and prototype projects.”

ST also takes care of activation and deployment by arranging for customers to use device-onboarding and service-provisioning platforms provided by ST Authorized Partner Truphone.

ST’s B-L462E-CELL1 Discovery kit uses the ST4SIM, allowing developers to test and evaluate all product features pre-integrated in a complete ecosystem.

The ST4SIM is certified by GSMA and manufactured at ST’s GSMA secure sites in Europe and southeast Asia. The ST4SI2M0020TPIFW is now available through e-distributors.

www.st.com

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