Startup raises $1m for high density etch technology

September 30, 2021 // By Peter Clarke
Swedish startup rises capital for IC pitch-reduction process
AlixLabs in Sweden has raised SEK9 million (US$1m) in a seed round to exploit developments in atomic layer etching below 20nm for smaller chips.

AlixLabs in Lund says its Atomic Layer Etch Pitchsplitting (APS) technology allows a high degree of packing of devices and eliminates several steps in the manufacturing process to achieve denser logic and memory.

The technology is able to split nanostructures in half using a single atomic level etching step which is an inherently damage-free etch process. The process makes use of inclined surfaces – readily fabricated by dry etching or epitaxial growth – to provide masking for the ALE process that can thereby produce small structures in a precise and efficient way.

The method works with both single-exposure immersion lithography and extreme ultraviolet (EUV) lithography and corresponding multiple patterning technologies such as self-aligned double and quadruple patterning as well as multiple exposure lithography-etch and directed self-assembly (DSA).

Almi Invest is investing close to SEK 3 million and is joined by private investors, including North American ice hockey professionals Michael, Alexander and William Nylander.

The money will be used to continue product development and validation of the APS technology, the company said.

"Today, we have a number of ongoing negotiations with R&D actors, equipment and semiconductor manufacturers to create a basis for further cooperation for the development of our products," said Jonas Sundqvist, CEO of AlixLabs, in a statement. "In the longer term, we want to create an ecosystem covering the complete value chain for APS and we hope to have a strong base in Europe with a global reach."

"The R&D from these funds will allow us to strengthen and expand our IP portfolio for our proprietary APS-technology," said Dmitry Suyatin, CTO of AlixLabs.

www.alixlabs.com

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