Thermal interface materials for burn-in and test

June 25, 2019 //By Julien Happich
Thermal interface
Indium Corporation has added a non-silicone based metal/polymer thermal interface material (TIM) designed for burn-in and test applications.

The HSMF-OS thermal interface specifically designed for high insertion capability. Its high tensile strength and soft compliant polymer backing allows it to survive multiple insertions. HSMF-OS has been tested to withstand over 5,000 insertion cycles without any loss of performance. One of the challenges associated with a burn-in TIM is the attachment method. HSMF-OS has inherent adhesive properties on one side that allow for hand placement, removing the need for these additional steps and fixtures without compromising thermal performance. The opposite side is aluminium and it will not mark or stain the DUI (device under test). HSMF-OS offers consistently good performance without phase change.

Indium - www.indium.com


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