Thermal interface materials combine liquid metal with a solid metal preform

March 15, 2019 //By Julien Happich
Thermal interface materials combine liquid metal with a solid metal preform
Indium Corporation has released a new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation.

m2TIM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity. The new hybrid interface materials come in a variety of alloys, including InGa and InGaSn, with extraordinary wetting ability to both metallic and non-metallic surfaces and extremely low interfacial resistance. They eliminate the risk of pump-out of the liquid alloy due to absorption by solid solder preforms

Indium Corporation - www.indium.com


Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.