The CEO also pitches the MEMS probe stations against atomic force microscopes (AFM) which are really optimized for surface metrology, hence suffering geometrical limitations due to cantilever geometry but also lacking the combined mechanical and electrical testing capability of the FT-MPS02.
The presentation then reviews several testing examples, among them, for a cantilever-type piezoresistive sensor, characterized with a vertical bending test.
One interesting aspect of the new instrument is that it can perform direct cantilever calibration on the wafer without the need for device packaging, highlighting property distribution of stiffness and output voltage at wafer-level, ultimately creating a wafer map and providing a yield rate evaluation.
This, Beyeler concludes, improves the efficiency of the MEMS R&D process in small labs, from design houses to academia.
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