ToF image sensor offers HVGA resolution

February 25, 2019 //By Julien Happich
ToF image sensor offers HVGA resolution
Infineon Technologies’ fourth generation REAL3 image sensor is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses.

The wide range of use cases includes secure user authentication like face or hand recognition to unlock the device and confirm payments. In addition, the 3D ToF chip enhances augmented reality, morphing and photo (e.g. bokeh) effects and can be used to scan a room. Measuring only 4.6x5mm, the image sensor features a 150 k (448x336) pixel output that comes close to the HVGA standard resolution. This makes the resolution four times higher than that of most ToF solutions on the market today. The pixel array is highly sensitive to 940 nm infrared light and provides unbeaten outdoor performance. This is enabled by the patented Suppression of Background Illumination (SBI) circuitry in every pixel. Due to its high level of integration, each IRS2771C image sensor is essentially a miniature single-chip ToF camera. This dramatically reduces the overall bill of materials and the actual size of the camera module without compromising on performance and keeping power consumption to a minimum. Samples of the chip will be available in March and volume production is scheduled to start in Q4 2019.

Infineon - www.infineon.com/real3


Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.