The tags fully leverages the new ICs’ increased sensitivity in a RAIN RFID inlay and tag design that combines a compact 42 mm form factor with ARC-confirmed global performance and reliability. With its small form factor, the Impinj M700-powered Miniweb delivers on the promise of small, universal RAIN RFID inlays and tags that can be attached to, or embedded in, nearly any item in any operating frequency worldwide. The inlays and tags are available with Impinj M730 and M750 ICs, with 128-bit EPC memory and 96-bit EPC memory plus 32-bit user memory, respectively. Both new Impinj ICs provide increased sensitivity, improved readability, and advanced features enabling new solutions for loss prevention with frictionless self-checkout and embedded tagging with seamless product returns. Both ICs are compatible with the GS1 UHF Gen2v2 protocol which ISO/IEC standardized as 18000-63. Smartrac has adopted new manufacturing processes using state-of-the-art IC attachment technologies and equipment to fully leverage Impinj’s 300 mm silicon wafer design, which yields twice as many ICs per wafer as conventional 300 mm wafers. By applying leading-edge IC attachment technologies that use fast cure sealing silicone (ACP), Smartrac can rapidly and significantly expand its RFID inlay and tag manufacturing capacity and operating throughput to provide very fast product availability. Sample quantities are expected in the first quarter of 2020, with high volumes early Q2 2020.
Smartrac - www.smartrac-group.com