Underfill epoxy offers thermal conductivity and electrical insulation

November 21, 2019 //By Julien Happich
Underfill epoxy
Master Bond’s EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications.

It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulating and thermally conductive with very fine particle size filler material. EP29LPTCHT can be easily dispensed into tiny gaps and when used as an adhesive, it forms thin bond lines from 5 to 15 microns, resulting in a significantly low thermal resistance of 12x10 -6 K•m 2/W to 15x10 -6 K•m 2/W. EP29LPTCHT features excellent flow properties with an initial mixed viscosity of 5,000-15,000 cps. It offers a long working life after mixing, for example a 100 gram batch at 75°F will yield an open time of 10 to 12 hours. EP29LPTCHT has a thermal conductivity of 9-10 BTU•in/(ft 2•hr•°F) and a volume resistivity of more than 10 15 ohm-cm, both measured at 75°F. After curing, compressive strength is 24,000-26,000 psi with a hardness of 80-90 Shore D.

Master Bond - www.masterbond.com


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