Alpha Data in Edinburgh, Scotland, has launched its second generation development kit for FGPGAs in space applications.
The ADK-VA600 Versal Core Development Kit for Space 2.0 is aimed at developing the next generation of adaptable data processing in space. The kit includes space qualified, radiation tolerant devices from Texas Instruments, Teledyne e2v and Infineon Technologies around the recently launched Xilinx XQR Versal AI Core VC1902 ACAP FPGA.
The 6U VPX ADK-VA600 provides a complete radiation tolerant reference design featuring Space-Enhanced Plastics (SEP) power management and critical system monitoring devices from Texas Instruments, Rad-Tolerant DDR4 memories from Teledyne e2v and Rad-Tolerant Flash memory from Infineon Technologies.
The ADK-VA600 is designed to be a space-enhanced product for multi-year missions in extreme environments including low-earth orbit. The 6U VPX form factor is suitable for lab development, while a 6U Space VPX version is available for rapid deployment.
Alpha Data’s ADK-VA600 also includes an Infineon Space Plastic flash memory for self-configuration as well as an accessible front panel VITA 57.4 FMC+ site for advanced IO and Data Converter module connectivity. The VPX Rear Transition Module provides further IO flexibility, advanced system monitoring, test access and target scrubbing features.
“We are excited to announce our Versal Core Development Kit for Space 2.0,” commented David Miller, Managing Director of Alpha Data. “This latest collaboration with our partners Xilinx, Texas Instruments, Teledyne e2v and Infineon Technologies enables customers to rapidly develop a complete processing solution, reducing costs and time to launch.”
The ADK-VA600 development kit will begin shipping in Q1 2022.
- Xilinx expands space FPGA range
- Rad hard 20nm FPGA puts AI in space
- ST, Xilinx team to power rad hard FPGAs
- Radiation tolerant serial NOR Flash memory for space
- Project takes automotive AI chips into space
Other articles on eeNews Europe
- Deal creates largest European foundry capacity for integrated photonic circuits
- Leti combines nine research tracks for sustainable electronics
- Machine learning boost for complex chip and package reliability analysis
- Return of smartphone manufacturing in Germany
- Galway in line for Intel megafab
- Imagination looks to IPO or sale
- NXP teams for Tensilica’s latest AI cores