WiFi6E chip adds MIMO

March 04, 2021 // By Nick Flaherty
WiFi6E chip adds MIMO
Infineon has launched two chips with both WiFi6E and Bluetooth 5.2 with support for multiple antennas to boost performance

Infineon Technologies has launched the industry’s first 1x1 WiFi6E and Bluetooth 5.2 single chip for the IoT and industrial applications.

The AIROC WiFi6E combo solutions operate in the 2.4 GHz, 5 GHz, and the new, greenfield 6 GHz spectrum to deliver robust performance and minimal latency. Infineon has also launched the first 2x2 WiFi6E and Bluetooth 5.2 combo chip for multimedia, consumer and automotive applications.

The multiple antenna support gives double the wireless coverage range compared to WiFi5 and WiFi4, with 40 percent more coverage than typical Wi-Fi 6/6E solutions and improved connection robustness with enhanced interference mitigation. The chip also has lower latency and better Wi-Fi/BT coexistence over previous versions that improves multimedia streaming and gaming responsiveness in overlapping network environments. This enables 20 percent power savings for longer battery life.

The chips include multi-layer security protections with secured boot, firmware authentication and encryption and lifecycle management for industrial IoT applications.

“AIROC Wi-Fi 6/6E combo solutions address the challenges of congested 2.4 GHz and 5 GHz channels, and bring extraordinary audio and video quality for media applications and robust, long-range connections for IoT applications,” said Vikram Gupta, Senior Vice President of Infineon’s IoT Compute and Wireless Business Unit.

The Bluetooth 5.2 technology in AIROC adds high-quality audio with LC3 for new BLE audio use cases such as audio sharing and audio broadcast. A low-power Wake-on-Bluetooth LE mode allows the host CPU to conserve power while the Bluetooth core autonomously “listens” for incoming connection requests. Advanced wireless technology innovations have been added to improve BT/BLE range, robustness, latency and power savings above and beyond standard BT5.2. Infineon’s Smart Coex coexistance design maximizes Wi-Fi throughput when used concurrently with Bluetooth, and optimizes for demanding multi-media use cases.

Infineon’s module partners have used the chip to enable rapid development, reduced test costs, and product certification.

“Collaborating with Infineon allows us to leverage our combined expertise to develop innovative Wi-Fi solutions which further build upon our market-leading position,” said

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