X-FAB expands foundry offering for silicon-based microfluidics

May 19, 2020 //By Julien Happich
microfluidics
In order to address heightening demands, X-FAB Silicon Foundries has taken steps to simplify the integration of microfluidic elements with CMOS and SOI dies.

Part of its extensive MEMS-oriented technology offering, the company is now able to provide a large variety of process capabilities for silicon- based microfluidic systems. Combined with a highly standardized foundry approach, this will help to remove barriers to market entry and shorten development cycles.

To outline the full scope of its microfluidics capabilities, X-FAB will be hosting an informative webinar on the 27th and 28th May. Click here to register.
X-FAB has already established itself as the leading semiconductor foundry with regard to the integration of silicon-based microfluidics, making $25 million worth of investment in this area over the course of the last 5 years.

In that time, the company has undertaken numerous projects for medical and industrial clients. These include applications such as lab-on-a-chip, DNA sequencing and synthesis, cancer diagnostics, etc. Through these projects, its engineering team has gained unmatched proficiency in areas like noble metal processing, high aspect-ratio deep reactive ion-etching (DRIE) and the deposition of both organic and inorganic materials. The team has also become highly adept at tailoring the interfaces needed to connect CMOS dies and their accompanying microfluidics elements, so the exact application requirements can be met.

Using all this expertise as a foundation, the company has extended its process capabilities to now include:
• Noble metal electrode arrays
• Inorganic layers for surface passivation and protection
• Deep silicon trenches and cavities
• Bonded silicon or glass lid wafers
• Polymeric fluidic structures


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