AMD buys Enosemi for silicon photonics boost
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AMD has acquired US silicon photonics startup Emosemi to boost its AI datacentre chip interconnect capability.
Nvidia last month highlighted the importance of integrating silicon photonics with GPUs for high speed datacentre interconnect. Enosemi has developed 1.6 terabit/s photonic chiplets and design IP that incorporates the key high-speed analog and photonic components needed for AI interconnects.
These chiplets and IP include high efficiency modulators, modulator drivers, transimpedance amplifiers, and integrated control systems fabricated in a 300mm wafer manufacturing process at GlobalFoundries.
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IP for 100G PAM4 modulator drivers, TIAs, modulators, as well as key integrated control system IP is available in the GF Fotonix catalogue to monolithically integrate 45nm CMOS transistors with photonic devices. An electro-optical process design Kit (PDK) allows customers to co-simulate electrical and optical circuits.
“As part of AMD, the team will help us immediately scale our ability to support and develop a variety of photonics and co-packaged optics solutions across next-gen AI systems,” said Brian Amick, Senior Vice President, Technology and Engineering at AMD.
“The team has a proven track record of building and shipping photonic integrated circuits in volume, a unique feat that few select teams have accomplished. Their depth of experience, technical rigor, and track record of execution make them an ideal fit for AMD as we push deeper into high-performance interconnect innovation,” he said.
“The demands of AI systems will require not just powerful chips, but full-stack innovation across compute, networking, systems architecture, software and more. AMD is uniquely positioned to deliver across this stack, bringing together our industry-leading CPUs, GPUs, and adaptive SoCs with deep networking, software, and system integration expertise.”
AMD bought server maker ZT Systems last year for $4.9bn to provide this full stack manufacturing. The terms of the Enosemi deal were not disclosed.
Enosemi has a recent deal with contract manufacturer Jabil which is supplying silicon photonics packaging services to support higher bandwidth interconnects within AI compute systems. Enosemi and Jabil are developing the critical advanced packaging process technology to support highly integrated electronic-photonic chiplet assemblies in Canada
“Jabil is the ideal partner to not only develop leading edge manufacturing processes, but also provide our customers with a path to scale that can leverage Enosemi’s highly integrated photonic chiplets. This collaboration with Jabil will demonstrate the suitability of Enosemi’s chiplet and design IP technology for use within AI compute systems,” said said Matt Streshinsky, CEO of Enosemi.
“We have invested to create our Advanced Photonics Packaging NPI centre in Ottawa, Canada, and we are glad to provide our experience to Enosemi for the packaging of their advanced product,” said KW Hoo, VP, global business units at Jabil.
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