Bosch splits automotive chip development
“Due to the high project volume, we have decided to split our development of Integrated Circuits into two areas,” said Jens Knut Fabrowsky, Executive Vice President, Automotive Electronics at Robert Bosch.
“Starting January 2022, Dr. Oliver Wolst leads a new organization focusing on the development of System on Chip (SoC) for Advanced Driver Assistance Systems (ADAS), SoCs for ADAS sensors like Radar and IP modules,” said Fabrowsky.
The other organisation will focus on the development of sensor ASICs for MEMS devices as well as our smart power ASICs. This will be led by Frank Herrmann who is now Vice President Engineering Automotive Mixed Signal ASICs.
The move coms after significant changes in the board at Bosch at the start of the year.
- Bosch relies on Microsoft for automotive connectivity platform
- Arduino, Bosch team for smallest AI sensor board
Other articles on eeNews Europe
- Rimac spins out technology division
- Prepare for chip recession says analyst
- First live demo of WiFi 7 technology
- Wiliot opens up its technology with starter kit
- €20m project to build room temperature diamond quantum processor