CGD develops packages for GaN thermal boost

CGD develops packages for GaN thermal boost

Technology News |
By Nick Flaherty

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Cambridge GaN Devices (CGD) has announced two proprietary packages for its ICeGaN integrated power devives to allow higher thermal performance.

Developed for CGD, the DHDFN-9-1 (Dual Heat-spreader DFN) GaN package is a thin, dual-side cooled package with a 10×10 mm footprint and wettable flanks to simplify optical inspection. It offers low thermal resistance (Rth(JC), and can be operated with bottom-side, top-side and dual-side cooling, offering flexibility in design and out-performing the often-used TOLT package in top-side and, especially, dual-side cooled configurations.

The DHDFN-9-1 package has been designed with dual-gate pinout to facilitate optimal PCB layout and simple paralleling, enabling customers to address applications up to 6 kW with ease.

The BHDFN-9-1 (Bottom Heat-spreader DFN) is a bottom-side cooled package, also with wettable flanks for easy inspection. Thermal resistance of the 10 x 10mm package is 0.28 K/W, making it similar to the commonly-used TOLL package.

Improving thermal resistance performance has several benefits. First, more power output is available at the same RDS(on) . Devices also run at cooler temperatures for the same power, so less heatsinking is required, resulting in reduced system costs. Lower operating temperatures also lead to higher reliability and longer lifetimes. Finally, if cost is the constraint for the application, designers can use a lower cost part with a higher RDS(on) and still achieve the required power output.

 “These new packages are part of our strategy to enable customers to use our ICeGaN GaN power ICs at higher power levels,” said Nare Gabrielyan, product marketing at CGD. “Servers, data centres, inverters/motor drives, micro-inverters and other industrial applications are all beginning to enjoy the power density and efficiency benefits that GaN brings, but they are also more demanding. Therefore, it is essential for such applications that devices are also rugged and reliable, and easy to design in. These attributes are inherent in ICeGaN, and are supported and extended by the new packages.”

The new packages will be shown for the first time at the PCIM exhibition at the Nürnberg Messe next week.


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