COM Express board taps AMD for AI inference
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congatec in Germany has launched a COM Express Compact Computer-on-Modules for AI applications.
The conga-TCR8 Type 6 COM Express modules use the Ryzen Embedded 8000 Series processors from AMD< which now describes itself as a data centre chip supplier. The processors have up to eight Zen 4 cores, XDNA neural processing unit (NPU) and Radeon RDNA 3 graphics. The modules provide up to 39 tera operations per second (TOPS) for AI inference in edge applications.
The congatec COM Express modules are aimed at high-volume, price-sensitive applications requiring a combination of advanced AI, graphics, and computing power. OEMs in medical imaging, test & measurement, AI-supported POS/POI systems, and professional gaming can leverage these long-term available COM Express Compact modules to accelerate innovation while ensuring investment security.
The scalable TDP thermal envelope of 15 to 54 W means the modules are also ideal for upgrading existing designs. By simply replacing modules, companies can bring their products to the latest state of the art, significantly improving lifecycle, ROI, and sustainability.
The new conga-TCR8 Computer-on-Modules from congatec are available with four different AMD Ryzen Embedded 8000 processors featuring six or eight Zen 4 cores. They support up to 128GB DDR5-5600 memory with error correction code (ECC) for data-intensive and data-critical applications.
The Radeon RDNA 3 GPU can also be used for AI tasks with up to 12 compute units and with the NPU provides up to 39 TOPS. They also support immersive graphics output on up to four displays with resolutions as high as 8k. For fast peripheral connectivity, they offer six PCIe Gen 4 (8 lanes) with PEG x8 Gen 4, three DisplayPort (DP) interfaces, one eDP or LVDS, four USB 3.2 Gen 2 ports, and four USB 2.0 ports. Audio signals are delivered via HAD, and mass storage can be integrated through two SATA 6 Gb/s ports or an optional NVMe SSD directly on the module. Classic embedded interfaces such as SPI, UART, I2C, and GPIO complete the feature set.
The modules are also available as application-ready aReady.COMs, with custom pre-installed and validated operating systems such as ctrlX OS, Ubuntu and/or RT Linux, optional system consolidation via aReady.VT, and IoT connectivity via aReady.IOT. On request, the modules can be pre-installed with the customer’s application, allowing for simple plug-and-play integration into the finished system.
“Our AMD Ryzen Embedded 8000-based modules not only expand our range of high-performance edge AI platforms for innovative applications, but also offer developers easy access to system consolidation benefits in the aReady.COM variant. This processor platform, featuring powerful CPU, GPU, and NPU cores, is perfectly suited for such consolidation. Customers and users benefit from cost, efficiency, and reliability advantages thanks to a configured hypervisor, pre-installed operating systems, accompanying IoT software for enhanced functionality, and flexible expansion options,” explains Martin Danzer, Director Product Management at congatec.
The conga-TCR8 COM Express Compact modules are available in the following variants:
|
Model |
TDP |
Cores |
Threads |
Base clock / Turbo |
Compute Units |
|
AMD Ryzen Embedded 8845HS |
45 W (35-54 W) |
8 |
16 |
3.8 / 5.1 |
12 |
|
AMD Ryzen Embedded 8840U |
28 W (15-30 W) |
8 |
16 |
3.3 / 5.1 |
12 |
|
AMD Ryzen Embedded 8645HS |
45 W (35-54 W) |
6 |
12 |
4.3 / 5.0 |
8 |
|
AMD Ryzen Embedded 8640U |
28 W (15-30 W) |
6 |
12 |
3.5 / 4.9 |
8 |
www.congatec.com/en/technologies/com-express/
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