COM-HPC boards with Intel 13th Gen processors target IoT
Kontron has launched two COM-HPC boards using Intel’s 13th Gen Core Raptor Lake U/P/H and Raptor Lake-S mobile and desktop processors.
The COMh-caRP and COMh-ccAS provide 14 cores up to 24 cores with Intel’s hybrid architecture for connected IoT applications.
The power envelope ranges from 15 to 45W TDP with multithreading 20 threads for the mobile processor and up to 32 for the desktop processor.
Up to 96 graphics units provide high-performance graphics and fast video processing for impressive experience and highly parallel AI workloads with four display pipes and Pipelock synchronization. The modules come with 64GB (mobile processor) or 128GB (desktop processor) of LPDDR5 memory and up to 2x 2.5 Gbit Ethernet, including TSN support.
The COMh-caRP client module with the mobile processor measures 95 x 120mm and supports In-Band Error Correction Code (IBECC) memory, Intel Time Coordinated Computing, Time Sensitive Networking (TSN), and extended temperature ranges of -40 °C to +85 °C max.
Selected versions are compliant to industrial use conditions of 100 percent operation over 10 years and support Windows 10 IoT Enterprise 2021 Long-Term Servicing Channel (LTSC) and EFLOW as well as Linux kernel overlay for easy deployment of IoT capabilities. As storage medium, an NVMe SSD up to one terabyte can be optionally integrated onboard.
Embedded controller
A new embedded controller on the latest Kontron boards replaces the previous CPLD-based variant and enabling direct Linux kernel support. This provides improved availability and optimized interfaces such as UART, GPIOs, HW monitor, fan control, I2C or watchdog. In addition, it can read and react to environmental data from CPU and chipset.
The COMh-ccAS is a size C module measuring 160 x 120mm and can be used with the socketed 13th Gen Core desktop processor up to 65W TDP>
A flexible thermal connection allows the use of both low-cost standard heatsinks as well and a low-profile passive cooling connection. Depending on the configuration level, three different chipsets can be used; PC client or embedded use case variants are available. In addition, the new module comes with two TSN-capable 2.5 Gbit Ethernet ports. If required, it can be equipped with four DDR5 SODIMM memories for up to 128 GB.
An evaluation carrier board for all the COM-HPC Client modules supports developers with a PCIe connection of all available interfaces, USB 3.X and USB4 interfaces (Thunderbolt) and a POST code display for easy commissioning.
www.kontron.com/en/products/comh-carp/p176930; www.kontron.com/en/products/comh-ccas/p172993
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