COM-HPC module for high performance edge AI
congatec in Germany has launched a COM-HPC Computer-on-Module (COM) for power-hungry edge and infrastructure applications.
The conga-HPC/cBLS is based on the performance hybrid architecture of the Intel Core S processors (codenamed Bartlett Lake S) with up to 16 Efficient (E) and up to 8 Performance (P) cores for up to 32 threads.
The COM-HPC Client Size C module measures 120×160 mm and is aimed at medical imaging, test & measurement, communication & networking, retail, energy, and banking. Additional use cases include video surveillance for traffic monitoring, as well as automation applications like optical inspection, which also benefit from the module’s enhanced performance.
The conga-HPC/cBLS COM-HPC Client Size C module is particularly suitable for high-performance real-time applications with workload consolidation. The firmware-integrated hypervisor-on-module facilitates direct access to the benefits of system consolidation. The module is an economical alternative to classic motherboards, particularly for applications that constantly require maximum performance and therefore regular performance upgrades.
Compared to motherboards, standardized COMs offer high scalability and an easy upgrade path through a simple module exchange, even across processor generations. The basic design does not need to be changed.
The module has up to 42 PCIe lanes, including 16 lanes with PCIe Gen 5 and up to 12 lanes with PCIe Gen 4. The integrated Intel Graphics with up to 32 execution units can be used for edge AI inference with fast DDR5-4000 memory with ECC support for data-critical applications.
“The heterogeneous computing architecture, featuring powerful Intel Graphics and Deep Learning Boost, makes the module a highly performant, low-power server capable of AI inference for power-hungry edge applications. When used as a GPGPU, it offers a unique performance-per-dollar ratio. Support for Intel TSN and TCC provides a foundation for networked real-time applications in sectors such as medical technology, automation, and industrial solutions,” said Jürgen Jungbauer, Senior Product Line Manager at congatec.
The module is also available as application-ready, custom-configured aReady.COMs, including validated pre-installed and licensed operating systems such as ctrlX OS, Ubuntu, and/or RT-Linux.
Optional features include system consolidation with aReady.VT and IoT connectivity. For even faster time-to-market, the modules can be preloaded with the customer’s application, enabling users to simply plug them into their finished systems.
With the firmware-integrated Hypervisor-on-Modules, the COM module can be used for visualisations in test & measurement systems, real-time control of production cells with HMIs and IoT gateways, and edge servers in smart grids.
The congatec service portfolio includes comprehensive board support packages, evaluation and production-ready application carrier boards, customized cooling solutions, extensive documentation and training, and high-speed signal integrity measurements. Application developers can also install the COM-HPC COMs on congatec’s Micro-ATX application carrier board (conga-HPC/mATX) for COM-HPC client modules. This provides access to the improvements of the new modules, including faster PCIe connectivity.
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www.congatec.com/en/products/com-hpc/conga-hpccbls/
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