congatec shows heatpipe cooling for COM module
German board maker congatec has shown its heatpipe cooling system for Computer-on-Module (COMs) for the first time.
The cooling system shown at Embedded World in Nuremberg this week uses acetone as a working fluid in the heat pipes instead of water. This prevents the thermal transfer medium from freezing at extreme sub-zero temperatures and prevents damage to the cooling system, the module, and the entire system design.
The cooling system is also insensitive to mechanical stresses such as shock and vibration.
This allows COM modules to be used in more extreme climatic and mechanical conditions, such as arctic temperatures where more elaborate cooling systems have been used to achieve the required reliability. The heatpipe system is a more cost effective approach for COM-based designs that must operate reliably within a temperature range of -40 °C to +85 °C.
These applications include autonomous and conventional vehicles that are exposed to extreme conditions, such as logistics vehicles in ports, airports, and cold stores, as well as rail and aviation systems, and any other scenario where extreme temperatures and mechanical stresses could affect system reliability.
“Our acetone-based cooling solution extends module-based designs to include applications under extreme operating conditions that could not previously be achieved with conventional cooling solutions. Using our application-ready COMs instead of expensive slot or special solutions allows developers to optimize time-to-market while reducing development effort and the overall costs of their applications,” said Jürgen Jungbauer, Senior Product Line Manager at congatec.
The heatpipe cooling system can be paired with the COM Type6 conga-TC675 or conga-TC675r with the Intel Raptor Lake processor, but it can also be used with the COM-HPC Mini and Client form factors as well as COM-HPC Server for robust edge servers.
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