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congatec to show first COM-HPC mini modules

congatec to show first COM-HPC mini modules

New Products |
By Nick Flaherty



congatec is showing is first samples of COM-HPC Mini modules at embedded world 2023 next month.

Launched officially after final PICMG ratification of the new specification, the first high-performance COM-HPC Mini modules will be equipped with the new 13th Gen Intel Core processors (codename Raptor Lake) for high end embedded and edge computing clients.

 The COM-HPC Mini form factor predominantly addresses ultra-compact high-performance designs such as DIN rail PCs or rugged handhelds and tablets.

However, COM-HPC Mini also solves the issue that developers of ultra-compact COM Express systems have been facing when wanting to switch to COM-HPC to be able to utilize latest interface technologies.

The previously smallest COM-HPC footprint – COM-HPC Size A – did not allow this. Measuring 95×120 mm (11,400 mm²), it is almost 32% larger than the COM Express Compact form factor, which measures 95×95 mm (9,025 mm²). From a footprint standpoint, that’s 25 mm too wide to migrate existing COM Express designs to COM-HPC.

As COM Express Compact is the most widespread COM Express form factor and only the high end currently still uses the even larger COM Express Basic form factor, many developers faced considerable challenges, if only in terms of system design dimensions. This is key for COM-HPC Mini at 95×60 mm, opening up entirely new high-performance applications.

Together with congatec’s recently introduced high-performance Computer-on-Modules with 13th Gen Intel Core processors on COM-HPC Client Size A and Size C, developers now have all the Raptor Lake processors available in a range of form factors.

The COM-HPC standard opens up designs with higher data throughput, I/O bandwidth and performance density that cannot be achieved with COM Express. congatec’s COM Express 3.1 compliant modules with 13th Gen Intel Core processors, on the other hand, primarily help to secure investments in existing OEM designs, for instance by providing upgrade options for more data throughput thanks to PCIe Gen 4 support.

www.congatec.com/en/technologies/com-hpc-mini/

 

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