First 64 Gbit/s fully integrated loopback MEMS switch for data connectivity

 First 64 Gbit/s fully integrated loopback MEMS switch for data connectivity

Technology News |
By Nick Flaherty

Menlo Micro has used its MEMS technology to create a dual double-pole/triple-throw (2x DP3T) loopback switch for high speed data in test equipment.

The MM5620 2x DP3T switch operates from DC to 20 GHz with RF signal linearity that supports data  speed up to 64 Gbit/s (64 GT/s).

Using the micromachined MEMS switch technology allows a smaller device with higher levels of integration for example for parallel testing on space-constrained final test and probe test for mobile phone, graphics, network processors, as well as microprocessor and high-speed memory products.

The 8.2 mm x 8.2 mm x 1.6mm LGA system-in-package (SiP) integrates the switch driver and charge pump, along with loopback capacitors, offering significant board footprint reduction for high-volume production test solutions. This is a 90 percent reduction in size over conventional electromagnetic relay (EMR) devices.

The integrated loopback includes the decoupling capacitors, while also providing multiple high-speed connections back to the user test equipment and the 9mW power consumption further simplifies the system design.

The faster switching of under 10 µs operation time and under 2 µs release time) is 1000x faster than EMRs, enabling reduced test time and cost-of-test. Using MEMS also boost the reliability and lifetime of the switches to three billion switching cycles, 1000x longer than EMRs.

“The MM5620 provides the industry’s first fully-integrated differential loopback testing solution designed for demanding high-speed digital applications based on the latest PCIe Gen 5, Gen 6 and SerDes standards,” said Chris Giovanniello, Co-Founder and Senior Vice President of Marketing at Menlo Micro. “Faster data rates and high-speed buses are essential for next-generation artificial intelligence (AI), machine learning (ML), 5G infrastructure, data center and cloud-based connectivity applications. With the push to higher performance and the need to drastically reduce test costs, the MM5620 will help IC manufacturers increase their test coverage and yield, while increasing test throughput by up to 3x.”

The MM5620 will be available for sampling in Q2 2023


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