Flip-chip machine sees 5x speed boost
ITEC, the Dutch assembly equipment spinout of Philips and Nexperia, has developed a flip-chip die bonder that is 5x faster than current systems.
The increase in speed for flip-chip die bonding to 60,000 units per hour can drive down assembly costs and boost adoption, says ITEC.
The increase comes from the use of two rotating heads rather than the traditional XY linear placement. This TwinRevolve design can pick, flip and place the die in a fast, smooth action with an accuracy of 5 μm @ 1σ (one standard deviation). This level of precision, combined with its ultra-high throughput, opens possibilities for a whole new generation of products where flip-chip assembly was previously too slow and too expensive, says the company. The use of flip-chip packages can also contribute to more reliable products with lower power consumption and better high-frequency and thermal management performance compared to traditional wire bonds.
The TwinRevolve technique is used in the ASAT3 XF, which also has an autoloader for strip magazines (in-outgoing) takes four magazines at a time with an option for E142 substrate mapping. The machine accepts 8- to 12-inch (200- to 300-mm) wafers through an automatic wafer change unit with barcode reader that provides full die traceability, auto recipe download (MES interface) and SECS/GEM interface.
A separate flux screen printer can be added as an inline-setup or the TwinRevolve can run as a standalone tool with strip magazine input/output, a flux screenprint inspection module is an option. Additionally, the die bonder is equipped with full servo-controlled bond-force/pick-force settings and auto-diagnostics to monitor machine health. Five high-resolution (up to 5 MPixel) cameras at key process points help keep operation under close control. They monitor glue, pre-pick, back/front side, post-bond and optional sidewall. Flux-related inspection includes drop size and shape, and coverage with respect to Cu pillar size.
“We believe our new ADAT3 XF TwinRevolve flip-chip die bonder represents a significant step forward in the manufacturing of advanced flip chips and chiplets, aligning with the vision for the future of factory operations”, said Mark van Kasteel, Commercial Director at ITEC. “Its automated features, coupled with a design that requires significantly less space, contribute to a reduction in maintenance, operational hours, and energy consumption, ultimately leading to a smaller carbon footprint.”
The die bonder takes several types of QFN, DFN, HVQFN, SOT, SO, TSSOP and LGA leadless and leaded packages, and can handle 100×300 mm strip size.
Headquartered in Nijmegen, the Netherlands, ITEC is a back-end semiconductor equipment manufacturer specializing in high-volume production of semiconductors as partner to Philips and Nexperia. In 2021, ITEC became a separate legal entity.
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