High resolution multispectral line scan camera extends defect detection beyond the surface

New Products |
By Nick Flaherty

Teledyne DALSA has launched a high resolution multispectral Camera Link HS (CLHS) line scan camera to boost inspection systems.

The camera provides spectrally independent RGB and NIR outputs making it capable of handling some of the most challenging inspection applications by detecting defects both on and under the surface of a wide variety of materials, components, and products.

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The Linea ML 8k multispectral camera uses Teledyne’s latest CMOS 8k quad linear sensor with a 5×5 μm pixel size and delivers a maximum line rate of 70 kHz x 4 using CLHS fibreoptic interface. The camera also has built-in SFP+ transceivers that convert electrical signals to optical signals and connects directly to fibreoptic cables using LC connectors.

“The Linea ML 8k multispectral camera offers versatile capabilities to meet the increasingly demanding requirements of a number of today’s challenging inspection applications, like banknotes, passports, and other high security print,” said Xing-Fei He, Senior Product Manager at Teledyne DALSA. “In addition, we have been able to deliver spectrally independent outputs of the RGB and NIR channels which enables accurate defect detection both on and under the surface of products like semiconductor wafers and printed circuit boards (PCBs) in a single scan, greatly simplifying vision system designs.”

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