 
                                    Infineon launches EasyPACK C SiC power modules for EV charging and storage
 Cette publication existe aussi en Français
                                                Cette publication existe aussi en Français
                                            
                                                                            Infineon Technologies has launched new SiC power modules in its EasyPACK C family aimed at high-power industrial applications such as fast DC EV charging, megawatt charging systems, energy storage and UPS equipment. The first modules in the series integrate Infineon’s 1200 V CoolSiC MOSFETs G2 and the company’s .XT interconnection technology to improve efficiency and extend operating life.
For eeNews Europe readers, this release underscores how silicon carbide is continuing to reshape power electronics architectures, offering efficiency improvements and reliability gains in electrification and renewable energy systems.
Higher power density and extended device lifetime
The EasyPACK C line targets systems with fluctuating loads and harsh operating conditions. Infineon reports that the new modules can deliver more than 30% higher power density and achieve up to 20 times longer lifetime compared to earlier CoolSiC MOSFET generations. Additionally, they feature approximately a 25% reduction in RDS(on), which helps reduce conduction losses and overall system power consumption.
The updated EasyPACK C housing improves layout flexibility and accommodates higher-voltage configurations, supporting future scalability. The inclusion of Infineon’s .XT interconnection technology helps extend module reliability under demanding thermal and electrical cycling conditions — an important requirement in EV fast-charging stations and industrial storage systems targeting long field lifespans.
Thermal improvements and mechanical upgrades
Infineon designed the new modules to withstand overload switching temperatures up to Tvj(over) = 200°C. The company added PressFIT pins to double current-carrying capability, reduce PCB temperatures, and simplify assembly. A new high-temperature plastic housing combined with silicone gel enables continuous operation up to Tvj(op) = 175°C. The modules provide 3 kV AC isolation for one minute, supporting reliable operation in demanding industrial conditions.
Together, these improvements enable higher system efficiency, better thermal stability, and longer operational lifetimes — key considerations for infrastructure operators aiming to minimize service intervals and maximize return on investment.
 If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
                                        
                                            
                                               eeNews on Google News
                                        If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
                                        
                                            
                                               eeNews on Google News
                                        
                                                                    
 
                    
                 
                    
                 
                    
                 
                    
                 
                    
                 
                                            
                                        