
Intel eyes Bavaria for wafer fab
The German state of Bavaria has proposed using a disused air base in Penzing-Landsberg, west of Munich, as a possible location for a leading edge wafer fab, says a report by Reuters quoting German Economy Minister Hubert Aiwanger.
The southern German state of Bavaria is home to automobile manufacturers Audi and BMW, who along with Daimler and Volkswagen have seen shortages of ICs slowing production of cars and the idling of some plants. This has raised security of semiconductor supply to political consciousness in recent months.
However while the Europe Union has talked about forming a domestic semiconductor alliance including Infineon, NXP and STMicroelectronics to cut dependence on foreign chipmakers, none of these players has expressed interest in making leading-edge digital chips.
The European Union has been seeking to open conversations with one or more of the global leaders in semiconductors, Intel, Samsung and TSMC and received some traction from Europe
Speaking to CNBC Intel CEO Pat Gelsinger said he would announce the location for a European megafab for foundry chip production “before the year’s out,” suggesting a deal is close to being agreed.
Related links and articles:
Related articles:
- Chip shortage hits payment cards
- Why is the chip shortage getting worse?
- Chip prices to rise as shortage goes into 2022, says Gartner
- NXP: automotive chip shortage to continue
- Renesas fire exacerbates chip shortage for auto industry
- Chip shortage boost for Mouser
- Raspberry Pi shortage driven by demand
Other articles on eeNews Europe
Mayflower autonomous ship starts record transatlantic crossing
€8m project for Europe’s first RISC-V supercomputer chip
CEO Interview: Accelerating OpenRAN 5G wireless technology
imec builds working forksheet transistors for 2nm, 1nm
3nm physical IP tapes out for ARMv9 designs
$8m for cloud-native edge IoT startup