Jacobs to design OSAT packaging plant in India
US consultancy Jacobs is to design a new Outsourced Semiconductor Assembly and Test (OSAT) packaging plant at Sanand, Gujrat in India.
CG Semi, a joint venture between CG, Renesas Electronics and Stars Microelectronics (Thailand), has appointed Jacobs for the engineering design of the OSAT packaging plant.
The main facility is planned to be built on more than 28 acres. The OSAT facility will manufacture a variety of advanced and legacy packages for industries such as automotive, consumer, industrial and 5G.
The company, a majority owner of PA consulting in the UK, will provide engineering design services for the main plant as well as engineering, procurement and construction services (EPCS) on smaller lines to establish a world-class OSAT facility.
This will support an $11bn semiconductor fab being constructed by Tata and Powerchip in Gujarat to provide a capacity o f50,000 wafer starts a month for a range of process technologies alongside a Tata assembly plant.
“Jacobs partnering with CG Semi on this pivotal project underscores our commitment to delivering innovative and sustainable solutions in the rapidly expanding semiconductor market in India,” said Bob Pragada, Chair and CEO ar Jacobs. “With our extensive experience in the U.S., Europe and Asia, and proven capabilities, we are eager to contribute to the success of their new facility, helping to drive growth and technological advancement in the region.”
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