Low power ARM M33 microcontroller family for consumer designs
Renesas Electronics has launched a low power microcontroller series for consumer equipment based on the ARM Cortex-M33 core.
The RA4L1 microcontroller comprises of 14 devices use an 80MHz clock for low power and add power saving modes and security features.
The family also includes microcontrollers with support for segment LCD displays and capacitive touch sensors for water meter, smart locks, IoT sensors and more. The chips include a unique ID and a security engine supporting TRNG, AES and hash encryption as well as ECC error correction.
The RA4L1 series uses proprietary low-power technology with 168 µA/MHz power consumption in active mode and a standby current of 1.70 µA with all the SRAM retained for instant recovery from sleep mode. There is 256 to 512 KB of Dual-Bank Flash for over the air updates, 64 KB of SRAM and 8 KB of dataflash.
The devices are also available in very small packages including a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP) for portable printers, digital cameras and smart labels.
The RA4L1 MCUs are supported by Renesas’ Flexible Software Package (FSP) for application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions.
FSP allows customers to integrate their legacy code and choice of RTOS for flexibility in application development and migration of existing IP to and from either the RA6 or RA2 Series devices.
“The RA4L1 Group is our response to customers who require the unique combination of ultra-low power with better CPU performance, segment LCD support and advanced security,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas.
AS well as the 3.64 x 4.28 mm WLCSP72 package there is a 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64 and 7 x 7 mm BGA100. There is an ambient temperature range of -40º to +125º C for the QFN, QFP and CSP package and -40º to +105º C for the BGA package option
The RA4L1 MCUs are available now, along with the FSP software. Renesas is also shipping an RA4L1 Evaluation Board and an RA4L1 Capacitive Touch Renesas Solution Starter Kit (RSSK).
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