MEMS Packaging Substrates Market Set to Reach $3.23 Billion by 2030
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The global market for MEMS packaging substrates is projected to grow from USD $2.40 billion in 2025 to USD $3.23 billion by 2030, according to a MarketsandMarkets report. The growth is being driven by the expanding medical device sector, accelerating 5G deployment, and the widespread adoption of IoT solutions.
For eeNews Europe readers, this growth — a compound annual growth rate (CAGR) of 6.1% — underscores key innovation opportunities for substrate materials and advanced packaging technologies critical to next-generation sensor and actuator design. Innovations across automotive, medical, and industrial applications are expected.
Glass substrates poised for rapid growth
The report identifies glass substrates as the fastest-growing segment within the MEMS packaging substrate market. Their unique combination of electrical insulation, optical transparency, chemical resistance, and thermal stability makes them well suited for high-performance MEMS designs. As more optical, biomedical, and environmental sensors are integrated into compact systems, glass substrates are gaining favor for their ability to support through-glass vias (TGVs), offering high-density interconnections, better signal integrity, and minimized parasitic effects.
These characteristics are especially valuable in IoT, automotive, and healthcare applications. In addition, advances in glass processing (e.g., laser drilling and anodic bonding) are driving down costs and improving scalability. The report notes that the push toward transparent, inert materials in lab-on-chip diagnostics, optical MEMS, and environmental monitoring sensors will continue to fuel this growth.
Asia Pacific leads in production and demand
The Asia Pacific region is expected to maintain its dominance in the MEMS packaging substrate market through 2030. Home to major players such as Samsung, Sony, Huawei, Xiaomi, and Panasonic, the region remains a leader for consumer electronics and IoT device manufacturing. Rapid adoption of smartphones, wearables, AR/VR systems, and smart home technologies has created sustained demand for compact and efficient MEMS components.
Further supporting this growth is the region’s leadership in 5G infrastructure and smart city development, both of which are heavily reliant on MEMS-based sensors. With strong domestic consumption and export capability, countries like China, Japan, and South Korea are likely to drive ongoing innovation and production in MEMS packaging technologies.
Market outlook and key players
According to the report, leading companies in the MEMS packaging substrate market include CoorsTek Inc. (US), CeramTec GmbH (Germany), KYOCERA Corporation (Japan), AGC Inc. (Japan), PLANOPTIK AG (Germany), Shin-Etsu Chemical Co., Ltd. (Japan), WaferPro (US), SCHOTT (Germany), Okmetic (Finland), and HongRuiXing (Hubei) Electronics Co., Ltd. (China). As demand for smarter, smaller, and more reliable devices continues to expand, MEMS packaging substrates (particularly glass-based solutions) will likely play an increasingly vital role in enabling the next generation of connected, high-performance electronics.
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