Multiphysics simulation tools boosts power chip package designs
uPI has doubled the thermal cycle endurance of its power management chip packages with Ansys’ multiphysics simulation.
The predictive simulation enables uPI to accelerate R&D and improve electrical performance while decreasing the risk of late-stage design changes.
The tools allow uPI to predict the electrical, mechanical, and thermal characteristics of the high-performance chip package designs quickly and with predictive accuracy. This leads to improved product performance, streamlined design, and reduced risk of late-stage design changes.
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The tools analyze heat flow and thermomechanical stresses to optimize the package designs and double the thermal reliability. Products that initially failed after 500 thermal test cycles were optimized with Ansys simulation to endure more than 1,000 cycles.
“Ansys’ multiphysics simulation solutions enable uPI to optimize our chip package designs and dramatically improve product reliability,” said Mr. Zhuang, packaging R&D manager at uPI. “With critical insights from Ansys’ simulation tools into electrical, thermal, and structural characteristics, our teams have accelerated development and verification while significantly improving efficiency, reducing design errors, and enhancing product quality.”
Ansys simulation tools also predict the electrical characteristics of packages across a range of signal frequencies, which helps uPI engineers identify optimal design solutions and improve product performance.
“Chip package design involves complex, multidimensional engineering that is nonlinear and can behave unexpectedly, even for small changes,” said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Ansys’ simulation tools provide end-to-end multiphysics analyses that enable teams to gain insight quickly into multiple areas of chip packaging with predictive accuracy. With Ansys, uPI is able to maximize their R&D and reliability testing processes to achieve high-quality products.”
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