New compact SiC MOSFETs with high-power TOLL package
According to ROHM, it has expanded its wide-bandgap portfolio with the launch of the SCT40xxDLL SiC MOSFET series in a compact TOLL (TO-Leadless) package. The new devices deliver significantly improved thermal characteristics and higher voltage capability in a slimmer footprint, positioning them for next-generation power designs in data-center, industrial, and energy-storage applications.
For eeNews Europe readers designing dense power electronics, this release highlights a potentially meaningful advance in power device packaging, offering new options for meeting aggressive size, thermal, and efficiency targets.
Higher power density for next-gen systems
Across applications such as AI servers, ESS platforms, and compact PV inverters, engineers face dual pressures: rising power requirements and shrinking system dimensions. ROHM indicates new TOLL-packaged SiC MOSFETs directly address these challenges.
Compared with conventional TO-263-7L packages of similar voltage rating and R_DS(on), the TOLL devices deliver approximately 39% better thermal performance, enabling higher power handling despite a low-profile design, the company notes. The components also reduce PCB footprint by around 26% and achieve a device height of just 2.3 mm, roughly half that of legacy alternatives, making them suitable for “pizza-box-type” slim power supplies where discrete components must stay below 4 mm.
Beyond mechanical advantages, ROHM indicates that it extends electrical capability as well: while typical TOLL MOSFETs top out at 650 V, the SCT40xxDLL family supports up to 750 V, providing increased surge margin and allowing designers to reduce gate resistance for lower switching losses.
New SiC 0ptions
According to the company, the SCT40xxDLL range comprises six models spanning 13 mΩ to 65 mΩ R_DS(on), covering a broad set of power stages and topologies including totem-pole PFC circuits for high-efficiency server and telecom supplies. Mass production began in September 2025.
ROHM notes that the devices are available immediately through major distributors including DigiKey, Mouser, and Farnell, ensuring straightforward adoption for design engineers across Europe. To accelerate evaluation, simulation models for all six variants can be downloaded from ROHM’s website.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
