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PSMC to create 300mm wafer fab in Japan

PSMC to create 300mm wafer fab in Japan

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By Peter Clarke



Taiwan’s Powerchip Semiconductor Manufacturing Corp. (PSMC) and finance firm SBI Holdings Inc. have agreed to establish a 300mm wafer fab in Japan. The move is part of Japan’s effort to strengthen its semiconductor supply chain, PSMC said.

No timetable or monetary budget was given for the project.

In January 2023 PSMC was reported to be in discussions with the Indian government about helping build a wafer fan there (see Taiwan foundry in talks over Indian wafer fab). PSMC offers a variety of manufacturing process technologies behind the leading-edge including logic, DRAM and flash memory, PMICs, CMOS image sensors, and high-voltage circuits. It is Taiwan’s third largest foundry behind TSMC and UMC.

PSMC said that along with SBI Holdings it will form a preparatory company to carry out fab planning and construction. Yoshitaka Kitao CEO of SBI Holdings said cooperation with Taiwanese companies is the key to the success of Japan’s revitalization of its semiconductor sector.

Frank Huang, chairman of PSMC, said the foundry company has both memory and logic process capabilities and that it will focus on circuits for AI edge computing as well as packaging technologies. Huang added it will help strengthen Japan domestic IC supply chain, by developing 22nm and 28nm and higher process technologies and wafer-on-wafer 3D stacking technology.

Powerchip is currently looking at three or four potential sites and manufacturing could begin two years after construction starts, according to reports. Powerchip could hope to get up to 40 percent of the cost of building its wafer fab under Japanese government initiatives to re-invigorate its chip industry.

Japan has agreed to provide about US$2.8 billion to help TSMC establish a wafer fab in Kumamoto prefecture to supply Sony Corp. and automotive chips company Denso Corp. (see Japan to provide 40 percent subsidy to TSMC, Sony venture). Japan is also funding a startup Rapidus to produce logic chips at the leading edge with support from IBM (see Rapidus seeks billions of dollars to use IBM’s 2nm process).

Related links and articles:

www.powerchip.com

News articles:

Taiwan foundry in talks over Indian wafer fab

Japan to provide 40 percent subsidy to TSMC, Sony venture

Top ten foundries saw 1Q23 revenue drop, rankings change

China to gain foundry chip production share despite sanctions

Rapidus seeks billions of dollars to use IBM’s 2nm process

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