ROHM introduces DOT-247 SiC module, delivering high design flexibility and power density
ROHM has introduced the DOT-247, a 2-in-1 silicon carbide (SiC) molded module designed to deliver higher design flexibility and power density in industrial power applications such as PV inverters, UPS systems, and semiconductor relays. By retaining the familiar TO-247 footprint while doubling up on chip capacity, the new module aims to simplify system integration and shrink power conversion designs.
For eeNews Europe readers, this launch highlights how packaging innovation in SiC can push power density while reducing system complexity—key concerns for designers working on next-gen energy and industrial platforms.
Double-package design with higher density
The DOT-247 (SCZ40xxDTx, SCZ40xxKTx) combines two TO-247 packages into a single molded module, allowing the integration of larger chips that were previously difficult to fit. Thanks to an optimized internal structure, the device achieves about 15% lower thermal resistance and 50% lower inductance compared to a standard TO-247 package. In a half-bridge configuration, that translates into 2.3 times higher power density—delivering the same output in roughly half the volume.
ROHM is offering the DOT-247 in two topologies, half-bridge and common-source, to cover the mixed configurations seen in multi-level circuits. Today’s PV inverters typically use two-level designs, but demand is rising for higher-voltage three- and five-level circuits such as NPC, T-NPC, and ANPC. By standardizing half-bridge and common-source topologies into a 2-in-1 module, ROHM reduces the need for custom parts while enabling easier adoption of advanced architectures like DC-DC converters and NPC circuits.
Support tools and availability
Evaluation boards will be released progressively, alongside a full support package that includes in-house motor testing, simulations, and thermal design data. An evaluation kit for double-pulse testing is already on the market, with a 3-phase inverter kit and reference designs expected in November 2025. SPICE models are available now, while LTspice models for three-level NPC circuits will follow in October 2025.
Mass production will begin in September 2025. Automotive-grade versions compliant with AEC-Q101 will ship as samples in October 2025.
“ROHM is committed to providing application-level support, including the use of in-house motor testing equipment,” the company stated.
With the DOT-247, ROHM is positioning its SiC module portfolio to address the growing demand for compact, high-density solutions in renewable energy and industrial power systems.
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