Samsung taps Cadence digital twin tech for 3D IC thermal analysis

Samsung taps Cadence digital twin tech for 3D IC thermal analysis

Business news |
By Nick Flaherty

Samsung and Cadence have signed a deal to use digital twin technology for 3D-IC thermal management.

The initiative addresses the critical challenges of advanced packaging and thermal management for 3D-ICs using digital twin technology.

As chip designs become more complex and performance demands escalate, ensuring efficient heat dissipation becomes paramount. Without proper thermal management, chips can overheat, leading to reduced performance, system instability, and even permanent damage.

Different materials used in the chip and packaging process react differently to heat, necessitating a thorough understanding and precise control. Temperature fluctuations can cause warping in the chip package, potentially leading to connectivity issues and compromised reliability.

Addressing these issues requires a holistic approach where mechanical, electrical, and material sciences intersect, enabling comprehensive tool chains that ensure both device performance and longevity. 

Cadence multiphysics analysis and 3D-IC design tools integrate various physics domains early in the design flow. This allows engineers to anticipate and mitigate potential issues before they escalate, and are being integrated with digital twin technology.

Samsung is using the Cadence tools for High Bandwidth Memory (HBM) chips that use multiple layers, often exceeding traditional limits, significantly increasing thermal and mechanical challenges.

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Samsung and Cadence have developed a digital twin for the manufacturing process that includes comprehensive simulations of the entire chip design, packaging, and operational environment.

The simulations replace numerous physical tests, accelerating the design cycle and identify and address potential issues early, reducing costly iterations and material wastage.

Comprehensive analysis ensures that the final product meets stringent performance and reliability standards.

Looking forward, the partnership aims to extend these benefits across a wider range of products and applications using 3D-ICs.


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